Smart Factory Solutions

Best-in-class placement solutions from entry level to more complex requirements for any mix, any volume, any time smart manufacturing.

Systems for plasma dicing and dry etching of wafers; plasma cleaning of wafers and substrates; and high quality ultrasonic flip-chip bonding.

Insertion platforms for radial and axial processes with high density and high speed. PTH / THT (Pin Through Hole / Through Hole Technology) solutions.

High-quality, reliable screen-printing technology for producing any assembly.

Designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy.

Odd-form and multiple applications, cost-reducing solutions. Replacement of manual process by trusted automated technology.