Smart Factory Solutions Mounting (SMT) Best-in-class placement solutions from entry level to more complex requirements for any mix, any volume, any time smart manufacturing.
Smart factory solutions Microelectronics solutions Systems for plasma dicing and dry etching of wafers; plasma cleaning of wafers and substrates; and high quality ultrasonic flip-chip bonding.
Smart Factory Solutions Insertion (THT/PTH) Insertion platforms for radial and axial processes with high density and high speed. PTH / THT (Pin Through Hole / Through Hole Technology) solutions.
Smart Factory Solutions Printing (SMT) High-quality, reliable screen-printing technology for producing any assembly.
Smart Factory Solutions Ultrahigh accurate 3-D profilometer (UA3P) Designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy.
Smart Factory Solutions Final Assembly, Test & Packaging (FATP) Odd-form and multiple applications, cost-reducing solutions. Replacement of manual process by trusted automated technology.