MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.
The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head.
The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.
The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder
Easy process exchange
Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.
Real-time inspection
The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.
User-friendly operation
A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
- Process versatility
- Ideal for processors, CMOS, MEMS and power devices
- Fast and accurate
Specifications
| Model ID | MD-P300 |
|---|---|
| Model No. | NM-EFF1C |
| Productivity*1 |
C4: 0.65s/IC (including dipping motion) Thermosonic: 0.65s/IC (including US process time of 0.2s) |
| Placement accuracy*1 | XY (3σ at PFSC conditions): ±5µm |
| Substrate dimensions (mm) | L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm) |
| Die dimensions (mm) | L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7) |
| Number of die types | Up to 12 product types (AWC specifications)*1 nozzle type |
| Die supply | Wafer frame 12 inches (Option: 8 inches) |
| Bonding load | VCM head: 1N to 50N (Option: 2N to 100N) |
| Head heating | Thermosonic: Up to 300°C |
| Substrate heating*2 | Constant heating, Up to 200°C (Heating bonding stage specifications: Max. substrate size L 330 × W 220mm) |
| Power source*3 |
3-phase AC 200V ± 10V, 50/60Hz, Up to 4kVA (Up to 7kVA for heating specification) |
| Pneumatic source | 0.4MPa, 50L/min (A.N.R.) (Up to 150L/min for full-featured machine including cooling air) |
| Dimensions (mm) | W 1380 × D 1640 × H 1430 (without loader / unloader) |
| Mass | 2300kg (without loader / unloader) |
Notes
- The described productivity and placement accuracy may differ depending on the conditions of use.
- Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually.
- 3-phase 208 / 220 / 380 / 400 / 415 / 480
For details, please refer to the specification sheet.
Downloads
| Name | File type | Size | Date | Language |
|---|---|---|---|---|
| MD-P300 Product Brochure.pdf | 289KB | English | ||
| MD-P300 White Paper - High throughput two-stage bonding technique for advanced wafer level packaging utilizing ATV Technologie’s SRO-71X-Thermo-compression Bonder_16_12_20.PDF | 1MB | English |