NPM-W2 / NPM-W2S
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
This platform is also available as a single-beam solution:
- NPM-W2S single beam allows various operations ranging, from NPM-series backup to multiple connection configuration.
|PCB dimensions (mm)||Single-lane*1||Batch mounting||L 50 x W 50 ~ L 750 x W 550|
|2-positin mounting||L 50 x W 50 ~ L 350 x W 550|
|Dual-lane*1||Dual transfer (Batch)||L 50 × W 50 ~ L 750 × W 260|
|Dual transfer (2-position)||L 50 × W 50 ~ L 350 × W 260|
|Single transfer (Batch)||L 50 × W 50 ~ L 750 × W 510|
|Single transfer (2-position)||L 50 × W 50 ~ L 350 × W 510|
|Electric source||3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA|
|Pneumatic source *2||0.5 MPa, 200 L /min (A.N.R.)|
|Dimensions *2 (mm)||W 1 280*3 × D 2 332 *4 × H 1 444 *5|
|Mass||2 470 kg (Only for main body : This differs depending on the option configuration.)|
|Placement head||Lightweight 16-nozzle head (Per head)||12-nozzle head (Per head)||Lightweight 8-nozzle head (Per head)||3-nozzle head V2 (Per head)|
|High production mode [ON]||High production mode [OFF]||High production mode [ON]||High production mode [OFF]|
|Max. speed||38 500cph (0.094 s/ chip)||35 000cph (0.103 s/ chip)||32 250cph (0.112 s/ chip)||31 250cph (0.115 s/ chip)||20 800cph (0.173 s/ chip)||
8 320cph (0.433 s/ chip)
6 500cph (0.554 s/ QFP)
|Placement accuracy (Cpk≥1)||±40 μm / chip||±30 μm / chip
(±25μm / chip)*6
|±40 μm / chip||±30 μm / chip||
± 30 µm/chip ± 30 µm/QFP
12mm to 32mm ± 50 µm/QFP
|± 30 µm/QFP|
|Component dimensions (mm)||0402*7 chip ~ L 6 x W 6 x T 3||03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3||0402*7 chip ~ L 12 x W 12 x T 6.5||0402*7 chip ~ L 32 x W 32 x T 12||0603 chip to L 150 x W 25 (diagonal152) x T 30|
|Component supply||Taping||Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm||Tape : 4 to 56 mm||Tape : 4 to 56 / 72 / 88 / 104 mm|
|Max.120 (Tape: 4, 8 mm)||
Front/rear feeder cart specifications : Max.120 (Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86 (Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60 (Tape width and feeder are subject to the conditions on the left)
|Stick||-||Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder)|
|Tray||-||Single tray specifications : Max.20 Twin tray specifications : Max.40|
|Dispensing head||Dot dispensing||Draw dispensing|
|Dispensing speed||0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)||4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9|
|Adhesive position accuracy (Cpk≥1)||± 75 μ m /dot||± 100 μ m /component|
|Applicable components||1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP||BGA, CSP|
|Inspection head||2D inspection head (A)||2D inspection head (B)|
|Resolution||18 µm||9 µm|
|View size (mm)||44.4 x 37.2||21.1 x 17.6|
|Inspection processing time||Solder Inspection *10||0.35s/ View size|
|Component Inspection *10||0.5s/ View size|
|Inspection object||Solder Inspection *10||
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
|Component Inspection *10||Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11||Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11|
|Inspection items||Solder Inspection *10||Oozing, blur, misalignment, abnormal shape, bridging|
|Component Inspection *10||Missing, shift, flipping, polarity, foreign object inspection *12|
Inspection position accuracy *13 (Cpk≥1)
|± 20 μm||± 10 μm|
|No. of inspection||Solder Inspection *10||Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)|
|Component Inspection *10||Max. 10 000 pcs./machine|
- Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
- Only for main body
- 1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
- Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm
- Excluding the monitor, signal tower and ceiling fan cover.
- ±25 μm placement support option.(Under conditions specified by PSFS)
- The 03015/0402 chip requires a specific nozzle/feeder.
- Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
- A PCB height measurement time of 0.5s is included.
- One head cannot handle solder inspection and component inspection at the same time.
- Please refer to the specification booklet for details.
- Foreign object is available to chip components.(Excluding 03015 mm chip)
- This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.